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AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

8–9 Apr 2013
LNF
Europe/Zurich timezone

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Session

TSV-based Vertical Interconnections

8 Apr 2013, 15:10
LNF

LNF

Conveners

TSV-based Vertical Interconnections

  • Abdenour Lounis (Universite de Paris-Sud 11 (FR))

Presentation materials

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  1. 37. Overview, state-of-the-art
    David HENRY (CEA-LETI-MINATEC)
    08/04/2013, 15:10
  2. 38. Keynote - Trend in Industry
    Mike Shapiro (IBM)
    08/04/2013, 15:40
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