Speaker
Daniel Muenstermann
(Lancaster University (GB))
Description
Recently, Fraunhofer ISE developed a technology with the potential to epitaxially produce very cost-efficient thin-films of 50-200 um thickness for the solar cell industry, aiming to lower the price for a 156mm by 156mm substrate to below the ~EUR level. Such thicknesses are precisely what is required for HL-LHC applications and the exitaxial growth might yield some additional benefits.
I would like to propose an RD50 common project to evaluate the suitability of such silicon for the production of sensors and - if successful - their radiation hardness. The presentation will provide details about the process and its limitations and a propose a roadmap for the procurement and processing of an initial batch of substrates.
