AIDA-2020 Fourth Annual Meeting

Session

WP4 Micro-electronics and interconnections

3 Apr 2019, 14:30

514. Introduction

Christophe De La Taille (OMEGA (FR)), Valerio Re (Universita and INFN (IT))

03/04/2019, 14:30

545. HGCROC1 test results and HGCROC2 design

Christophe De La Taille (OMEGA (FR))

03/04/2019, 14:40

526. A high-resolution Vernier Ring Oscillator TDC in TSMC 130 nm CMOS for CMS MG-RPC

Mokrane DAHOUMANE (Institut de Physique Nucléaire de Lyon (IPNL)/CNRS-IN2P3), Mokrane Dahoumane (Centre National de la Recherche Scientifique (FR))

03/04/2019, 15:00

593. Development of blocks for FLAME and HGCROC2 chips in TSMC 130nm and for lpGBT chip in TSMC 65nm

Marek Idzik (AGH University of Science and Technology (PL))

03/04/2019, 15:15

515. Recent results of the RD53A front-end chip

Mr Magne Eik Lauritzen (University of Bergen (NO))

03/04/2019, 16:00

516. From RD53A to RD53B: development of the next generation readout chips for the ATLAS and CMS experiments at the HL-LHC

Luigi Gaioni (Universita and INFN (IT))

03/04/2019, 16:20

561. Tests on FE-I4 modules with TSV, plans for TSV processing in RD53A wafers

Fabian Huegging (Universitaet Bonn (DE)), Fabian Huegging (University of Bonn)

03/04/2019, 16:40

612. TSV LETI summary

Abdenour Lounis (Centre National de la Recherche Scientifique (FR))

03/04/2019, 17:00

611. Discussion

Valerio Re (Universita and INFN (IT))

03/04/2019, 17:20