May 24 – 28, 2021
America/Vancouver timezone

RD53 pixel chips for the ATLAS and CMS Phase-2 upgrades at HL-LHC

May 25, 2021, 6:24 AM
Parallel session talk Readout: Front-end electronics Readout: Front-end electronics


Flavio Loddo (Universita e INFN, Bari (IT))


The Phase-2 upgrades of ATLAS and CMS will require a new tracker with readout electronics operating in extremely harsh radiation environment and high data rate readout.
The RD53 collaboration, a joint effort between the ATLAS and CMS experiments, developed in 2017 a large size demonstrator, called RD53A, to qualify the chosen 65nm CMOS technology and compare different analog front-ends and digital architectures for the development of the final production ASICs.
The final chips for the two experiments are being designed based on these results, having as a reference a common virtual baseline chip, called RD53B, which is adapted to the needs of each experiment. The RD53B-ATLAS version was submitted in March 2020 and it has been extensively tested, providing valuable results for the implementation of the RD53B-CMS version, which is planned to be submitted in March 2021.
A general overview of the chip architecture will be presented, as well as the first preliminary test results.

TIPP2020 abstract resubmission? No, this is an entirely new submission.

Primary author

Flavio Loddo (Universita e INFN, Bari (IT))

Presentation materials