An alternative pixel-detector hybridization technology based on Anisotropic Conductive Films (ACF) is under development to replace the conventional fine-pitch flip-chip bump bonding. The new process takes advantage of the recent progress in industrial applications of ACF and is suitable for time- and cost-effective in-house processing of single devices. This new bonding technique developed can also be used for the integration of hybrid or monolithic detectors in modules, replacing wire bonding or solder bumping techniques. This contribution introduces the new ACF hybridization and integration technique, and shows the first test results from Timepix3 hybrid pixel assemblies and from the integration of ALPIDE monolithic pixel sensors to flex circuits.
|TIPP2020 abstract resubmission?||No, this is an entirely new submission.|