Speaker
Description
The material budget in the innermost tracking layers is a critical parameter that strongly influences the impact parameter resolution especially for lower momentum particles. Monolithic silicon pixel detectors can be thinned to typical thicknesses of 100 µm or less, thus providing the possibility to minimize the silicon contribution in the material budget. The MALTA monolithic silicon pixel sensor is a large area radiation hard monolithic CMOS sensor developed in the 0.18 µm CMOS process. It provides the possibility to transfer data and power from chip to chip and first tests using ultrasonic Al-wedge wire bonding have validated this concept to build multi-chip modules. Several interconnection technologies are being studied to provide high quality and mechanically robust direct chip-to-chip connections between different MALTA chips. Transferring data (GHz) and power from chip-to-chip will further contribute to designing a low mass and compact MALTA module. This presentation will present the studies and first findings as well as plans to build a large area module.
