Speaker
Description
During Long Shutdown 3 of the LHC, the ATLAS detector will undergo substantial upgrades to prepare for data taking at the future HL-LHC. This includes a replacement of its inner detector with a fully silicon tracker called the ITk, composed of pixel and strip sub-detectors. During the pre-production phase of the ITk strips detector, it was discovered that thermal cycling modules after mounting them onto local support structures (staves and petals) induces physical cracks in some of the sensors. This phenomenon is understood to be the result of a combination of factors, including the thermomechanical properties of the module mounting glue, and the relative positions of the module’s electric components. These factors combine to create high pressure points on modules during temperature changes, an effect that must be solved as the detector components must be mechanically robust and able to withstand the planned detector warm-ups and cool-downs during HL-LHC. This presentation will show the electrical test results of modules on staves, investigating the effectiveness of strategies aimed at mitigating sensors fracturing.
