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    AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

    8–9 Apr 2013
    LNF
    Europe/Zurich timezone

    Support

    CAD tools for 3D-IC and TSV-based designs

    8 Apr 2013, 16:40
    20m
    LNF, Auditorium Touschek

    LNF, Auditorium Touschek

    Speaker

    Kholdoun TORKI (CMP)

    Presentation materials