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AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

8–9 Apr 2013
LNF
Europe/Zurich timezone

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Session

Chip stacking through microbump bonding

9 Apr 2013, 12:00
LNF

LNF

Conveners

Chip stacking through microbump bonding

  • Michael Campbell (CERN)

Presentation materials

There are no materials yet.

  1. 43. The combined technology of TSV and SLID bond
    Armin Klumpp (Fraunhofer EMFT)
    09/04/2013, 12:00
  2. 45. TSV and SLID for planar Silicon Detectors
    Anna Macchiolo (Max-Planck-Institut fuer Physik (Werner-Heisenberg-Institut) (D)
    09/04/2013, 12:20
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