12th Workshop on Electronics for LHC and future Experiments

Session

Plenary Session P4-HEP electronic and ASIC trends

P4

28 Sept 2006, 09:00

Valencia, Spain

119. 3D Circuit Integration for High Energy Physics

Ray YAREMA

28/09/2006, 09:00

Oral

Industry is pursuing 3D integrated circuits to enhance circuit performance. The techniques and technologies being employed can be of benefit to the High Energy Physics community. There are two general approaches that can be followed: die to wafer bonding, and wafer to wafer bonding. Each has its own benefits. Both of these approaches are being investigated at Fermilab. The...

120. Technology Scaling and CMOS Analog Design

Franco MALOBERTI (University of Pavia)

28/09/2006, 09:45

Oral

Modern and future ultra-deep-submicron technologies make challenging the analog design especially when power consumption must match digital counterparts. The decrease of the supply voltage reduces the voltage headroom in analog circuits, the gate leakage current increases, the voltage gain decreases in planar bulk transistors, 1/f noise deteriorate when using new high- k gate...