VCI2019 - The 15th Vienna Conference on Instrumentation

Session

Semiconductor Detectors

19 Feb 2019, 14:00

EI7

Conveners

Semiconductor Detectors

• Christoph Schwanda (Austrian Academy of Sciences (AT))

Semiconductor Detectors

• Marko Dragicevic (HEPHY Vienna)

Semiconductor Detectors

• Marko Dragicevic (HEPHY Vienna)

Semiconductor Detectors

• Markus Friedl (Austrian Academy of Sciences (AT))

Semiconductor Detectors

• Thomas Bergauer (Austrian Academy of Sciences (AT))

Semiconductor Detectors

• Christoph Schwanda (Austrian Academy of Sciences (AT))

629. EDET DH80k - Characterization of a DePFET based sensors for TEM Direct Electron Imaging

Mitja Predikaka (Semiconductor Laboratory of the Max Planck Society)

19/02/2019, 14:00

Semiconductor Detectors

Talk

The EDET DH80k is a 1 MPixel camera system, optimized for the direct detection of 300 keV electrons from a TEM equipped with a pulsed, high intensity electron source. It was designed to record stroboscopic movies of dynamic processes with unprecedented temporal and spatial resolution. The camera consists of four identical modules with the complete set of frontend and peripheral electronics...

608. Deep Diffused Avalanche Photodiodes for Charged Particle Timing

Matteo Centis Vignali (CERN)

19/02/2019, 14:25

Semiconductor Detectors

Talk

The upgrades ATLAS and CMS for the High Luminosity LHC (HL-LHC) highlighted physics objects timing as a tool to resolve primary interactions within a bunch crossing. Since the expected pile-up is around 200, with an rms time spread of 170ps, a time resolution of about 30ps is needed. The timing detectors will experience a 1-MeV neutron equivalent fluence of $\Phi_{eq}=10^{14}$ and...

659. New test beam results of 3D detectors constructed with poly-crystalline CVD diamond

Michael Philipp Reichmann (ETH Zurich (CH))

19/02/2019, 14:50

Semiconductor Detectors

Talk

The latest test beam results of 3D detectors fabricated with poly-crystalline
chemical vapor deposition (CVD) diamonds will be shown. The devices have
50$\mu$m $\times$ 50$\mu$m cells with columns 2.6$\mu$m in diameter. In
one of the devices the cells were ganged in a 3$\times$2 cell pattern and
in the other the cells were ganged in a 5$\times$1 cell pattern to match
the layouts of the pixel...

785. In-depth study of Inverse-Low Gain Avalanche Detectors (ILGAD) for 4-dimensional tracking and radiation tolerance assessment of thin LGAD

Esteban Curras Rivera (Universidad de Cantabria (ES))

19/02/2019, 15:15

Semiconductor Detectors

Talk

For the high-luminosity LHC upgrade, the ATLAS and CMS experiments are planning to include dedicated detector systems to measure the arrival time of Minimum Ionising Particles (MIPs). Such systems should provide a timing resolution of 30 ps per MIP. State-of-the-art timing technologies integrating Silicon photo-multipliers and plastic scintillators do not tolerate the hadron fluences expected...

640. Operational Experience and Performance with the ATLAS Pixel detector at the Large Hadron Collider

Kerstin Lantzsch (University of Bonn (DE))

19/02/2019, 16:30

Semiconductor Detectors

Talk

The tracking performance of the ATLAS detector relies critically on its 4-layer
Pixel Detector, that has undergone significant hardware and readout upgrades to
meet the challenges imposed by the higher collision energy, pileup and
luminosity that are being delivered by the Large Hadron Collider (LHC), with
record breaking instantaneous luminosities of 2 x 1034 cm-2 s-1 recently
surpassed.
The...

577. Operational Experience of the Phase-1 CMS Pixel Detector

Benedikt Vormwald (Hamburg University (DE))

19/02/2019, 16:55

Semiconductor Detectors

Talk

In 2017, CMS has installed a new pixel detector with 124M channels that features full 4-hit coverage in the tracking volume and is capable to withstand instantaneous luminosities of $2 \times 10^{34} cm^{-2} s^{-1}$ and beyond. Many of the key technologies of modern particle detectors are applied in this detector, like efficient DCDC low-voltage powering, high-bandwidth $\mu$TCA backend...

812. The CMS Pixel Detector for the High Luminosity LHC

Giacomo Sguazzoni (INFN (IT))

19/02/2019, 17:20

Semiconductor Detectors

Talk

The High Luminosity Large Hadron Collider (HL-LHC) at CERN is expected to collide protons at a centre-of-mass energy of 14 TeV and to reach the unprecedented peak instantaneous luminosity of $5-7.5x10^{34} cm^{-2}s^{-1}$ with an average number of pileup events of 140-200. This will allow the ATLAS and CMS experiments to collect integrated luminosities up to 3000-4500 fb$^{-1}$ during the...

738. Belle II Pixel Detector – Performance of final DEPFET Modules

Mr Botho Paschen (University of Bonn)

19/02/2019, 17:45

Semiconductor Detectors

Talk

In spring 2018 the SuperKEKB accelerator in Tsukuba, Japan, provided first e+e- -collisions to the upgraded Belle II experiment. During this commissioning phase the volume of the innermost vertex detector was equipped with dedicated detectors for measuring the radiation environment as well as downsized versions of the final Belle II silicon strip (SVD) and pixel (PXD) detectors.
The PXD is the...

546. The EUSO-SPB2 mission

Valentina Scotti

20/02/2019, 09:00

Astroparticle Detectors

Talk

EUSO-SPB2 is a second generation Extreme Universe Space Observatory (EUSO) on a Super-Pressure Balloon (SPB). The mission broadens the scientific objectives of the EUSO program and constitutes the first step towards the study of neutrino signals from the high atmosphere and space.
The EUSO-SPB2 science payload will be equipped with three detectors designed for a long duration mission. One is...

828. APiX: a two-tier avalanche pixel sensor for charged particle detection and timing.

Dr Paolo Brogi (Univ. of Siena and INFN Pisa, IT)

20/02/2019, 09:25

Semiconductor Detectors

Talk

A novel pixelated charged particle detector with fast timing capabilities is under development. It addresses two important requirements for the next generation of position sensitive detectors: minimization of material budget and power consumption, while providing high granularity and excellent timing. It is a "thin" (tens of micron), window-less, vertically integrated, CMOS detector. Internal...

898. Microfabricated silicon substrates for pixel detectors assembly and thermal management

Alessandro Mapelli (CERN)

20/02/2019, 09:50

Semiconductor Detectors

Talk

At CERN, the Detector Technologies (DT) group of the Experimental Physics (EP) department is actively investigating a number of innovative solutions for heat management and detector module assembly in HEP experiments. Among these, recent research carried out at EP-DT has focused on the development of microfluidic devices to cool silicon pixel detectors. In this respect, continuous advances in...

891. RD53A: a large-scale prototype chip for the phase II upgrade in the serially powered HL-LHC pixel detectors

Aleksandra Dimitrievska (Lawrence Berkeley National Lab. (US))

20/02/2019, 10:15

Semiconductor Detectors

Talk

The phase II upgrade of the HL-LHC experiments within the LHC intends to deepen the studies of the Higgs boson and to allow the discovery of further particles by adding an integrated luminosity of about $4000 fb^{-1}$ over 10 years of operation. This upgrade would overwhelm the installed pixel detector readout chips with higher hit rates and radiation levels than ever before. To match these...

619. The ATLAS ITk Strip Detector System for the Phase-II LHC Upgrade

John Stakely Keller (Carleton University (CA))

21/02/2019, 09:00

Semiconductor Detectors

Talk

The ATLAS experiment at the Large Hadron Collider is currently preparing for a major upgrade of the Inner Tracking for the Phase-II LHC operation, scheduled to start in 2026. The radiation damage at the maximum integrated luminosity of 4000/fb implies integrated hadron fluencies over 2x10^16 neq/cm2 requiring a completed replacement of the existing Inner Detector. An all-silicon Inner Tracker...

729. Commissioning of the Belle II Silicon Vertex Detector

Giulia Casarosa (INFN - National Institute for Nuclear Physics)

21/02/2019, 09:25

Semiconductor Detectors

Talk

The Belle II experiment at the SuperKEKB collider of KEK (Japan) will accumulate $e^+e^-$ collision data at an unprecedented instantaneous luminosity of $8\times 10^{35}$ cm$^{-2}$s$^{-1}$, about 40 times larger than its predecessor experiment. The Belle II vertex detector consists of two layers of DEPFET based pixels (PXD) and four layers of double sided silicon strip detectors (SVD). The SVD...

648. A High-Granularity Timing Detector for the Phase-II upgrade of the ATLAS Calorimeter system: detector concept, description and R&D and first beam test results

Bengt Lund-Jensen (KTH Royal Institute of Technology (SE))

21/02/2019, 09:50

Semiconductor Detectors

Talk

The increase of the particle flux (pile-up) at the HL-LHC with luminosities of L ≃ 7.5 × 10^34 cm−2 s-1 will have a severe impact on the ATLAS detector reconstruction and trigger performance. The end-cap and forward region where the liquid Argon calorimeter has coarser granularity and the inner tracker has poorer momentum resolution will be particularly affected. A High Granularity Timing...

782. The Gigatracker, the silicon beam tracker for the NA62 experiment at CERN.

Luca Federici (CERN)

21/02/2019, 10:15

Semiconductor Detectors

Talk

The Gigatracker is the NA62 beam tracker. It is made of three $63.1 mm \times 29.3 mm$ stations of $300 \mu m \times 300 \mu m $hybrid silicon pixel detectors installed in vacuum ($\sim10^{-6} mbar$).
The beam particles, flowing at 750 MHz, are traced in 4-dimensions by means of time-stamping pixels with a design resolution of $200 ps$. This performance has to be maintained despite the beam...

822. Silicon Detectors for the LHC Phase-II Upgrade and Beyond – RD50 Status Report

Tomasz Szumlak (AGH University of Science and Technology (PL)), on behalf of the RD50 Collaboration

21/02/2019, 14:00

Semiconductor Detectors

Talk

The inner tracking layers of all LHC experiments were designed and developed to cope with the environment of the present Large Hadron Collider (LHC). At the LHC Phase-II Upgrade foreseen for 2026, the particle densities and radiation levels will increase by roughly an order of magnitude compared to the present LHC conditions. Therefore, the inner tracking layers will need to be replaced. The...

778. High resolution three dimensional characterization of irradiated silicon detectors using a Two Photon Absorption-TCT

Marcos Fernandez Garcia (Universidad de Cantabria (ES))

21/02/2019, 14:25

Semiconductor Detectors

Talk

The Transient Current Technique (TCT) has been instrumental in the characterization of silicon radiation detectors over the last 20 years. Using visible or infrared lasers, excess carriers can be produced continuously along the beam propagation direction, the penetration depth of the light determining the length of the trail of charges. No spatial resolution is therefore obtained along this...

495. Measurements and Simulations of Surface Radiation Damage Effects on IFX and HPK Test Structures

Francesco Moscatelli (Universita e INFN, Perugia (IT))

21/02/2019, 14:50

Semiconductor Detectors

Talk

Radiation damage effects at High Luminosity LHC expected fluences (2×10¹⁶ n/cm² 1 MeV) and total ionising doses (TID) (1 Grad) will impose very stringent constraints in terms of radiation resistance of solid-state detectors. The complex physical phenomena related to radiation damage effects can be addressed by means of TCAD tools aiming at evaluate the most suitable...

542. Bulk engineering for enhanced lateral drift sensors

Hendrik Jansen (Deutsches Elektronen-Synchrotron (DE))

21/02/2019, 15:15

Semiconductor Detectors

Talk

Future experiments in particle physics foresee few-micrometer single-point position resolution in their vertex detectors, motivated by e.g. b/light-quark-tagging capabilities. Silicon is today's material of choice for high-precision detectors and offers a high grade of engineering possibilities. Instead of scaling down pitch sizes, which comes at a high price for an increased number of...

592. Measurement results of the MALTA monolithic pixel detector

Enrico Junior Schioppa (CERN)

21/02/2019, 16:30

Semiconductor Detectors

Talk

MALTA is a full scale monolithic pixel detector implemented in ToweJazz 180nm CMOS technology. The small pixel electrode allowed for the implementation of a fast, low noise and low power front-end, which is sensitive to the charge released by ionizing radiation in a 20-25 um deep depleted region. The novel asynchronous matrix architecture is designed to ensure low power consumption and high...

768. Radiation characterization of two large and fully depleted CMOS pixel matrices fabricated in 150 nm and 180 nm technologies

Toko Hirono (University of Bonn (DE))

21/02/2019, 16:55

Semiconductor Detectors

Talk

Two different design concepts of the depleted monolithic CMOS active sensor (DMAPS) are realized in the large scale pixel matrixes, named LF-Monopix and TJ-Monopix. They are realized in so-called large and small electrode design in a pixel. In the large electrode DMAPS, a high bias voltage of 300 V is applied to the highly resistive wafer without damaging the readout electronics. Full...

721. Towards wafer-scale monolithic CMOS integrated pixel detectors for X-ray photon counting

Jorge Neves (G-ray Medical)

21/02/2019, 17:20

Semiconductor Detectors

Talk

A new semiconductor process is being developed for manufacturing monolithic CMOS pixel detectors. The technology is based on direct bonding of 200 mm CMOS wafers to an absorber in a low-temperature, oxide-free, covalent wafer bonding process. It is applicable to any material such as Si, GaAs and epitaxial SiGe. The latter are realized by means of space-filling arrays of SiGe crystals which can...

831. Radiation hard active pixel sensor with 25µm x 50µm pixel size designed for capacitive readout with RD53 ASIC

Hui Zhang (Karlsruhe Institute of Technology (KIT))

21/02/2019, 17:45

Semiconductor Detectors

Talk

We will present a sensor chip for a capacitively coupled particle detector (CCPD). CCPDs have been proposed for several experiments and it has been demonstrated that the signals from the sensor to the readout chip can be transmitted when the chips are glued. However, it is still not proven whether gluing can be done fast on a large number of devices. Therefore, we are investigating a new...