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Description
High strength and conductivity CuAg micro-composites were fabricated via casting and accumulative bundling and drawing (ADB) process. CuAg with large cross-section exhibits competitive strength and conductivity properties for pulsed magnets use. The CuAg filaments and eutectic whiskers evolution during the compositing process was investigated. The tensile properties and thermal compression properties were analyzed. And the conductivity characteristics varied with the wire size were also investigated. And the mechanism for the mechanical properties was discussed. It is found that the whiskers refining is crucial for the increase of the strength. And the pure copper matrix added by bundling process will be beneficial to the electronic transporting.
