36th RD50 Workshop (CERN - - online Workshop)

Session

CMOS

5 Jun 2020, 13:00

Conveners

CMOS: CMOS

• Eva Vilella Figueras (University of Liverpool (GB))

13. Radiation tolerant small-pixel passive CMOS sensors with RD53A readout

Yannick Manuel Dieter (University of Bonn (DE))

05/06/2020, 13:00

With the HL-LHC upgrade of the ATLAS detector, the surface of the ATLAS pixel detector will increase from 2 m² to approximately 13 m² . Therefore, commercial CMOS processing lines offering high production throughput at comparatively low costs represent an attractive option for such large-area detectors. Further benefits originate from multiple metal layers, metal–insulator–metal capacitors,...

16. First tests and characterization of the RD50-MPW2 active pixel matrix, bandgap voltage reference and SEU tolerant memory

Dr Ricardo Marco Hernandez (CERN)

05/06/2020, 13:20

This contribution will be focused on the lab performance evaluation of the electrical parameters before irradiation of three different blocks of the RD50-MPW2 device, the 8 by 8 matrix of depleted monolithic active pixel sensors, the bandgap voltage reference and the SEU (Single Event Upset) tolerant memory array. The RD50-MPW2 was developed in the framework of the RD50 collaboration and...

25. A reconfigurable HR-CMOS sensor for Tracking, Pre-Shower and Digital Electromagnetic Calorimetry

Ioannis Kopsalis (University of Birmingham (GB))

05/06/2020, 13:40

Digital calorimetry relies on a highly granular detector where the cell size is sufficiently small so that only a single particle in a shower enters each cell within a single readout cycle. The DECAL sensor, a depleted monolithic active pixel sensor (DMAPS), has been proposed as a possible technology for future digital calorimeters. A DECAL sensor prototype has been designed and fabricated in...

29. Initial I-V and e-TCT measurements of a depleted CMOS sensor within the CERN-RD50 collaboration

Matthew Lewis Franks

05/06/2020, 14:00

Future high energy particle physics experiments, such as the High Luminosity Large Hadron Collider (HL-LHC) and the proposed Future Circular Collider (FCC), will reach unprecedented energies and produce many billions of particles per second to probe into physics beyond the standard model. As part of these experiments, detectors will need to be capable of recording this incredibly large number...

28. Data acquisition system for the characterization of the RD50 HV-CMOS active pixel matrix prototypes

Christian Irmler (Austrian Academy of Sciences (AT))

05/06/2020, 14:50

The data acquisition (DAQ) system used to read out and characterize the two versions of RD50 HV-CMOS prototype chips (MPW1 and MPW2) is based on the CaRIBOu (Control and Readout Inner tracking Board) system. CaRIBOu is a widely used versatile DAQ platform to characterize pixel detectors and ASICs, such as CLICpix2, C3PD and others. It consists of a system-on-chip board (e.g. Xilinx ZC706), a...

6. [US] Effects of neutron irradiation on HV-JFETs

Dr Gabriele Giacomini (Brookhaven National Laboratory (US))

05/06/2020, 15:10

We had p-type HV-silicon JFETs, fabricated at Brookhaven National Laboratory, irradiated with neutrons at the Triga reactor in JSI, up to a fluence of 1.5e15 neq/cm2. Most notably, output characteristics show a dramatic increase of the drain saturation voltage with the irradiation. By means of TCAD simulations, which used the Perugia radiation damage model, we are explaining this effect as due...

35. Discussion on CMOS devices

Eva Vilella Figueras (University of Liverpool (GB))

05/06/2020, 15:30