AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

Session

Through-Silicon Vias (TSV)

8 Apr 2013, 16:40

LNF

Conveners

Through-Silicon Vias (TSV)

• Hans-Gunther Moser (Werner-Heisenberg-Institut)

42. CAD tools for 3D-IC and TSV-based designs

Kholdoun TORKI (CMP)

08/04/2013, 16:40

53. Methods for architectural design - methods of 3D-integrated systems

Andy Heinig (EAS Fraunhofer Dresden)

08/04/2013, 17:00

41. Method for selecting optimal 3D IC technology for detectors

Makoto Motoyoshi (Tohoku-MincroTec Co., Ltd (T-Micro))

08/04/2013, 17:20

44. Micro bump-bonding and TSV 3D integration expertise at Fraunhofer IZM

Thomas Fritzsch (Fraunhofer IZM)

08/04/2013, 17:40

46. Tezzaron TSV-related activities

Robert Patti (Tezzaron Semiconductor)

08/04/2013, 18:00

48. Packaging technologies at IMB-CNM (CSIC)

Enric Cabruja Casas (IMB-CNM (CSIC))

08/04/2013, 18:20

40. 3D Integration Technology used for Hybrid Pixel Detectors : Medipix project latest results

David HENRY (CEA-LETI-MINATEC)

08/04/2013, 18:40