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AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

8–9 Apr 2013
LNF
Europe/Zurich timezone

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Session

Through-Silicon Vias (TSV)

8 Apr 2013, 16:40
LNF

LNF

Conveners

Through-Silicon Vias (TSV)

  • Hans-Gunther Moser (Werner-Heisenberg-Institut)

Presentation materials

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  1. 42. CAD tools for 3D-IC and TSV-based designs
    Kholdoun TORKI (CMP)
    08/04/2013, 16:40
  2. 53. Methods for architectural design - methods of 3D-integrated systems
    Andy Heinig (EAS Fraunhofer Dresden)
    08/04/2013, 17:00
  3. 41. Method for selecting optimal 3D IC technology for detectors
    Makoto Motoyoshi (Tohoku-MincroTec Co., Ltd (T-Micro))
    08/04/2013, 17:20
  4. 44. Micro bump-bonding and TSV 3D integration expertise at Fraunhofer IZM
    Thomas Fritzsch (Fraunhofer IZM)
    08/04/2013, 17:40
  5. 46. Tezzaron TSV-related activities
    Robert Patti (Tezzaron Semiconductor)
    08/04/2013, 18:00
  6. 48. Packaging technologies at IMB-CNM (CSIC)
    Enric Cabruja Casas (IMB-CNM (CSIC))
    08/04/2013, 18:20
  7. 40. 3D Integration Technology used for Hybrid Pixel Detectors : Medipix project latest results
    David HENRY (CEA-LETI-MINATEC)
    08/04/2013, 18:40
Building timetable...