Yoshinobu Unno
(High Energy Accelerator Research Organization (JP))
02/09/2013, 09:00
This will address the welcome message to the 9th International "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors (HSTD9)", a brief introduction to the history of the symposium, and the logistics of this year's sympsoium.
Manfred Krammer
(Austrian Academy of Sciences (AT))
02/09/2013, 09:20
On May 30, 2013 CERN Council approved the Update of the European Strategy for Particle Physics. This was the final step of a process involving the whole European particle physics community as well as many colleagues from outside Europe. The presentation gives an overview of the numerous facilities and projects proposed to the strategy group before explaining the decisions and the rational...
Marko Dragicevic
(Austrian Academy of Sciences (AT))
02/09/2013, 09:50
Most modern particle physics experiments use silicon based sensors for their tracking systems. These sensors are able to detect particles generated in high energy collisions with high spatial resolution and therefore allow the precise reconstruction of particle tracks. So far only a few vendors were capable of producing silicon strip sensors with the quality needed in particle physics...
Hartmut Sadrozinski
(SCIPP, UC santa Cruz)
02/09/2013, 10:10
We propose to develop a fast, thin silicon sensor with gain capable to concurrently measure with high precision the space (~10 μm) and time (~10 ps) coordinates of a particle.
In collaboration with groups within RD50, we have measured charge multiplication with a gain of about 10, allowing to thin pixelated silicon sensors by at least a factor 10 by keeping the performance of thick...
Giulio Pellegrini
(Centro Nacional de Microelectrónica (IMB-CNM-CSIC))
02/09/2013, 10:30
This work introduce a new concept of silicon radiation detector with intrinsic multiplication of the charge called Low Gain Avalanche Detectors (LGAD). These new detectors are based on the standard Avalanche Photo Diodes (APD) normally used for optical and X-ray detection applications. The main difference to standard APD detectors is the low gain requested to detect high energy charged...
Takahiro Ambe
(http://www.spxg-lab.phys.waseda.ac.jp/)
02/09/2013, 10:50
We developed a front-end ASIC for future PET scanners with time-of-flight (TOF)
capability to be coupled with 4×4 Multi Pixel Photon Counter (MPPC) arrays.
The ASIC is designed based on the open-IP project proposed by JAXA and realized in
TSMC 0.35 μm CMOS technology. The circuit comprises 16-channel, low impedance
current conveyers to effectively acquire fast MPPC signals. For precise...
Alessandro Gabrielli
(Universita e INFN (IT))
02/09/2013, 11:10
Electronics
The paper shows the design of microelectronic circuits composed of an oscillator, a modulator, a transmitter and an integrated antenna. Prototype chips were recently fabricated and tested exploiting commercial 130 and 180 nm CMOS technologies. Preliminary results are summarized along with some measurements of the prototypes behavior. In addition, wireless transmission capabilities have been...
Changwoo Seo
(Korea Electrotechnology Research Institue)
02/09/2013, 11:30
This paper presents how a large area thin film transistor (TFT) x-ray imaging sensor has been applied to calibrate the gantry geometry and acquire x-ray projection images in cone-beam computed tomography (CBCT) system. A cone-beam x-ray tube and TFT imaging sensor could enable imaging of entire organ in one axial acquisition using one rotation of the gantry. The gantry motion could measure,...
Alyssa Montalbano
(State University of New York (US))
02/09/2013, 11:50
With the need for very radiation hard semiconductor devices for the High Luminosity upgrade at the Large Hadron Collider, new types of silicon pixel detectors have been proposed. Since 3D Si pixel detectors have been shown to be more radiation hard than the planar ones, scientists at Brookhaven National Laboratory have chosen to design a novel type of 3D Si pixel detectors. Systematic full 3D...
Changwoo Seo
(Korea Electrotechnology Research Institue)
02/09/2013, 11:50
The physical performance characteristics of complementary metal oxide semiconductor (CMOS) and thin film transistor (TFT) x-ray imaging sensors are compared for the fluoroscopy and cone-beam computed tomography (CBCT) medical imaging application. In this paper, our developing CMOS x-ray imaging sensor has been designed with the 14.3 bit extended counting analog to digital converter (ADC) and...
Martin Printz
(KIT - Karlsruhe Institute of Technology (DE))
02/09/2013, 12:10
Radiation damage, Environmental radiation monitoring
The upgrade of the LHC machine to deliver a significantly higher luminosity of about 5 x 10^34 cm^(-2)s^(-1) is planned to be operational after 2020. This will significantly increase the radiation dose of the inner detector systems, requiring new radiation hard sensor materials for the CMS Tracker. To identify the appropriate materials which are able to withstand the radiation environment in...
Vitaliy Fadeyev
(University of California,Santa Cruz (US))
02/09/2013, 12:10
We are working on the proposed "BeamCal" project. Its goal is to detect scattered incoming beams at ILC at small angles, to prevent the background from two-photon processes to mimic signatures of new discoveries. The detector, which is envisioned as a tungsten sandwich calorimeter, will be subject to high fluences EM radiation that will shower in the tungsten radiator. We are exploring the...
Suen Hou
(Academia Sinica (TW))
02/09/2013, 12:30
The byte-wide optical link in the CDF Run II silicon tracking system has endured a decade of operation and delivered an integrated luminosity of 12 fb-1. The modules consist of a transmitter converting detector signals to optical pulses, connected with 22 m fiber ribbon cables carrying signals to receiver modules out of the detector. The data transmission is conducted with edge-emitting type...
Giulio Pellegrini
(Universidad de Valencia (ES))
02/09/2013, 13:10
AC-coupled silicon strip sensors can get damaged in case of a beam loss due to the possibility of a large charge accumulation in the bulk, developing very high voltages across the coupling capacitors which can destroy them [1]. Punch-through protection (PTP) structures are currently used to avoid this problem helping to evacuate the accumulated charge as large voltages are developing [2]....
Marko Mikuz
(Univ. Ljubljana / J. Stefan Inst.)
02/09/2013, 14:20
Rising the electric field so as to provoke charge multiplication of electrons has enabled silicon to provide measurable signals from sensors irradiated to unprecedented radiation levels up to 1.6x10^17 n_eq/cm^2. A simple scaling of collected charge vs. applied bias has been established experimentally for fluences above 10^15 n_eq/cm^2 for planar strip sensors. Departure from linear scaling of...
Atsushi Harayama
(Japan Aerospace Exploration Agency)
02/09/2013, 14:30
We report on the recent development of a 64-channel analog front-end ASIC for a new gamma-ray imaging system to visualize radioactive substances. The imaging system employs a novel Compton camera which consists of silicon and cadmium telluride (CdTe) detectors. The ASIC aims for the readout of pixel /pad detectors utilizing Si/CdTe as detector materials, and the dynamic range from 100 keV to...
Harris Kagan
(Ohio State University (US))
02/09/2013, 14:50
With the first three years of the LHC running complete, ATLAS and CMS are planning to upgrade their innermost tracking layers with more radiation hard technologies. Chemical Vapor Deposition (CVD) diamond is one such technology. CVD diamond has been used extensively in beam condition monitors as the innermost detectors in the highest radiation areas of BaBar, Belle, CDF and all LHC...
Kazuki Motohashi
(Tokyo Institute of Technology (JP))
02/09/2013, 14:50
Various structures for n-in-p planar pixel sensors have been developed at KEK in order to cope with the huge particle fluence in the upcoming LHC upgrades.
Performances of the sensors with the different structures have been evaluated with testbeam.
The n-in-p devices were connected by bump-bonding to the ATLAS Pixel front-end chip (FE-I4A) and characterized before and after the irradiation...
Yoshinobu Unno
(High Energy Accelerator Research Organization (JP))
02/09/2013, 15:10
We have fabricated n-in-p miniature silicon microstrip sensors and small test structures. A p-stop structure is implemented in order to isolate the n-implant against the inversion layer of electrons in the interface of silicon bulk and the oxide surface passivation. Along irradiation the strongest electric field is said to move from the edge of the n-implant to the edge of the p-stop due to...
Dmitry Hits
(Eidgenoessische Tech. Hochschule Zuerich (CH))
02/09/2013, 15:10
Progress in experimental particle physics in the coming decade depends crucially upon the ability to carry out experiments at high energies and high luminosities. These two conditions imply that future experiments will take place in very high radiation areas. In order to perform these complex and perhaps expensive experiments new radiation hard technologies will have to be developed. ...
Giovanni Calderini
(Centre National de la Recherche Scientifique (FR))
02/09/2013, 15:30
In view of the LHC upgrade phases towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. Because of its radiation hardness and cost effectiveness, the n-on-p silicon technology is a promising candidate for a large area pixel detector.
The talk reports on the joint development, by LPNHE and FBK of novel n-on-p edgeless...
Giulio Pellegrini
(Centro Nacional de Microelectrónica (IMB-CNM-CSIC))
02/09/2013, 15:50
The Alibava system has been developed in the framework of the CERN RD50 collaboration to test silicon microstrip detectors. The Alibava System is conceived to characterize strip radiation detectors, providing high sensitivity to small signals, high position resolution and high speed. The system is able to measure the collected charge in one or two microstrip silicon sensors by reading up to...
Ilhan Tapan
(Uludag University (TR))
02/09/2013, 16:10
In this presentation, general specification of Turkish Accelerator Center (TAC) Particle Factory (PF) facility will be given. TAC PF is a super charm factory with the asymmetric beam energy setup consisting of an electron beam with 1 GeV from a linac and a positron beam with 3.56 GeV from a ring, proposed as a linac-ring type collider and a dedicated detector. The main components of the...
Anna Macchiolo
(Max-Planck-Institut fuer Physik (Werner-Heisenberg-Institut) (D)
02/09/2013, 16:40
We present an R&D activity focused on the development of novel modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). They consist of n-in-p pixel sensors, 100 or 200 μm thick, produced at VTT (Finland) with an active edge technology, to considerably reduce the dead area at the periphery of the device. The sensors are interconnected with solder bump bonding to...
Vitaliy Fadeyev
(University of California,Santa Cruz (US))
02/09/2013, 17:00
We are pursuing a “slim edge” technology which allows a drastic reduction of inactive region along the perimeter of silicon detectors. Such reduction would benefit construction of large-area tracker and imaging systems. Key components of this method are surface scribing, cleaving, and passivation of the resulting sidewall. We will give a short overview of the project and describe recent...
Kock Kiam Gan
(Ohio State University (US))
02/09/2013, 17:20
Abstract
We will present the results from three R&D projects on high-speed/radiation-hard opto-links for the LHC upgrades. The goal is to develop a 12-channel high-speed driver to operate a 12-channel VCSEL array. The array allows the deployment of a compact 120 Gb/s parallel optical engines at a high-radiation location close to the interaction region where space is at a premium. We will...
Suen Hou
(Academia Sinica (TW))
02/09/2013, 17:40
The Light Peak technology aims for high speed optical cables of 10 Gb/s that overcome the limits of electrical cables in speed and length. Cables that comply with the USB 3 specification of 4.8 Gb/s are already delivered in market. The low-mass compact design of light coupling to opto-electronic is an advantage to high energy applications in tracking system. The high speed capacity provide a...
53.
Development of n-in-p large-area silicon microstrip sensors for very high radiation environments
Yoshinobu Unno
(High Energy Accelerator Research Organization (JP))
03/09/2013, 08:40
We have developed a novel and radiation-tolerant n-in-p silicon microstrip sensors for very high radiation environments such as high-luminosity LHC. The sensors are designed to be operable to the end-of-life fluence of ≥1×10^15 1-MeV neutron-equivalent/cm^2. The sensors are fabricated in p-type, float-zone, 6 in. wafers where we lay out two designs of large-area, 9.75 cm × 9.75 cm, strip...
Allan Clark
(DPNC, University of Geneva)
03/09/2013, 09:00
As part of the High Luminosity LHC upgrade (HL-LHC), a new Inner Tracking Detector (ITK) will be constructed for the ATLAS experiment, using silicon pixel and micro-strip technology.
A back-up prototype development for the micro-strip barrel detector of the ITK envisages double-sided modules of typically 10x10 cm2 assembled on a stiff but low material local support to form a ‘super-module’...
Yoshiyuki Onuki
(University of Tokyo)
03/09/2013, 09:20
The CP violation in the quark sector had been observed in 2001 by two B-factories, the Belle and BaBar experiments. The Belle II, upgrade of the Belle experiment, searching for the physics beyond the Standard model is under construction toward the physics run scheduled for the end of 2016. The vertex detector of the Belle II consists of two types of silicon detectors, of a pixel detector...
Craig Buttar
(University of Glasgow (GB))
03/09/2013, 09:40
The high-luminosity LHC will present significant challenges for tracking systems. ATLAS is proposing to replace the entire tracking system, including a significantly larger pixel detector. This paper reports on the development of large area planar detectors for the outer pixel layers and the pixel endcaps. Large area sensors have been fabricated and mounted onto 4 FE-I4 readout ASICs, so...
Helen Hayward
(University of Liverpool (GB))
03/09/2013, 10:00
Upgrade of the ATLAS tracker detector for high-luminosity LHC conditions requires novel approaches to the pixel sensor design. Tests of different pitch layouts represent significant part of the ATLAS upgrade program. Better momentum resolution and multiple track reconstruction in the r-phi plane could be achieved with finer phi-segmentation. The new proposed geometry adapts to the floorplan of...
Shintaro Kamada
(Hamamatsu Photonics K.K)
03/09/2013, 11:00
We, Hamamatsu Photonics K.K have been developing high raditation-tolerant n-in-p planar pixel sensors which can be used for HL-LHC.
N-in-p planar pixel sensor is one of candidate for HL-LHC, and has advantages of high radiation-tolerance with reasonable price (compared with 3D sensor or diamond sensor).
On the other hand, n-in-p planar pixel sensors also have some issues to be solved such...
Giovanni Calderini
(Centre National de la Recherche Scientifique (FR))
03/09/2013, 11:20
To extend the physics reach of the LHC, accelerator upgrades are planned which will increase the integrated luminosity from 730 to beyond 3000 fb-1 and the pile-up per bunch-crossing by a factor 5 to 10. To cope with the increased occupancy and radiation damage, the ATLAS experiment plans to introduce an all-silicon inner tracker with the HL-LHC upgrade.
To investigate the suitability of...
Reiner Klingenberg
(Technische Universitaet Dortmund (DE))
03/09/2013, 11:40
The innermost tracking detector of the ATLAS experiment at CERN-LHC consists of planar n-in-n pixel sensors with FE-I3 front-end electronics as hybrid. The 2013/14 newly to be installed insertable b-layer (IBL) at the ATLAS experiment will consist of pixel sensors with a revised design layout and an improved FE-I4 front-end electronics. The envisaged radiation dose in the forthcoming data...
Andrej Gorisek
(Jozef Stefan Institute (SI))
03/09/2013, 12:00
The Judith software performs pixel detector analysis tasks utilizing two different data streams such those produced by the reference and tested devices typically found in a testbeam. This software addresses and fixes problems arising from the desynchronization of the two simultaneously triggered data streams by detecting missed triggers in either of the streams. The software can perform all...
Cinzia Da Via
(University of Manchester (GB))
03/09/2013, 13:50
Micro-systems, based on MEMS technology, have been used in miniaturized low power and low mass smart structres in medicine, biology and space applications. Recently similar features found their way inside high energy physics with applications in vertex detectors for High-Luminosity LHC Upgrades, with 3D sensors, 3D integration and efficient power management using silicon micro-channel...
Gian-Franco Dalla Betta
(INFN and University of Trento)
03/09/2013, 14:20
An improved technology for double-sided 3D sensors with passing-through columns has been developed at FBK in collaboration with the University of Trento and INFN for the fabrication of 3D pixels for the ATLAS IBL [1]. The IBL production was successfully completed in 2012, with good results in terms of electrical characteristics and yield. On the same production wafers (p-type, 230±20 μm...
Nicola Pacifico
(University of Bergen, Norway)
03/09/2013, 14:40
Pixels (including CCD's) - Charged particle tracking
The aim of AEgIS is to measure the gravitational acceleration for anti-hydrogen in the Earth’s gravitational field, thus testing the Weak Equivalence Principle, which states that all bodies fall with the same acceleration, independent of their mass and composition. AEgIS will make use of a silicon detector in order to measure the deflection of anti-hydrogen from a straight path under the...
Ivan Peric
(Ruprecht-Karls-Universitaet Heidelberg (DE))
03/09/2013, 16:10
The high-voltage (HV) CMOS pixel sensors offer several good properties: a fast charge collection by drift, the possibility to implement relatively complex CMOS in-pixel electronics and the compatibility with the commercial processes. The sensor element is a deep-n-well diode in a p-type substrate. The n-well contains CMOS pixel electronics.
The main charge collection mechanism is drift in a...
Costanza Cavicchioli
(CERN)
03/09/2013, 16:40
Within the R&D activities for the upgrade of the ALICE Inner Tracking System (ITS), Monolithic Active Pixel Sensors (MAPS) are being developed and studied, due to their lower mass (~0.3% X/X0 for the inner layers) and higher granularity (~20 μm x 20 μm pixels) with respect to the present pixel detector.
This paper presents the design and characterization results of the Explorer0 chip,...
Shingo Mitsui
(High Energy Accelerator Research Organization (JP))
03/09/2013, 17:00
We are developing monolithic pixel detectors using a Silicon-on-Insulator (SOI) technology for X-ray and charged particle applications. It is based on a 0.2 um CMOS fully-depleted (FD-)SOI process of Lapis Semiconductor Co. Ltd. The SOI wafer consists of a thick, high-resistivity substrate for the sensing part and a thin Si layer for CMOS circuits.
To overcome back-gate effect affected by...
Hideaki Matsumura
(Kyoto University)
03/09/2013, 17:20
We have been developing monolithic active pixel sensors based on the Silicon-On-Insulator (SOI) CMOS technology, called XRPIX, for next-generation X-ray astronomy satellites. Compared to CCDs, which are currently used as standard sensors for X-ray astronomy, our devices have much better time resolution of ~ microsecond since they can issue triggers to determine X-ray arriving time. Therefore,...
Shuji Tanaka
(HIGH ENERGY ACCELERATOR RESEARCH ORGANIZATION, KEK)
03/09/2013, 17:40
The successful heavy flavor factory KEKB, operating between 1999 and 2010 at KEK, Tsukuba, Japan, is currently being upgraded to SuperKEKB, whichis foreseen to start commissioning in the fall of 2014. SuperKEKB will provide an instantaneous luminosity of 8x1035 cm2/s, 40 times higher than the current world record set by KEKB. For SuperKEKB, a nano-beam scheme is applied to achieve this...
Tadayuki Takahashi
(ISAS/JAXA)
04/09/2013, 08:40
Dust containing radioactive materials dispersed following the Fukushima nuclear power plant accident in March 2011. Gamma-rays are emitted in the process when unstable nuclei in the materials decay. Based on the technology of Si/CdTe Compton Camera, we have manufactured a quick prototype model for the use in the field. The camera, now called an ``Ultra-Wide-Angle Compton Camera'' was...
Kenshiro Takeuchi
(Waseda University)
04/09/2013, 09:10
The Compton camera is a viable and convenient tool used to visualize the distribution of radioactive isotopes that emit gamma rays. After the nuclear disaster at the Fukushima Daiichi power plant in 2011, a large amount of radioactive isotopes (e.g. 134Cs, 137Cs) was released and widely dispersed, thus making the removal thereof is still an urgent task. In response, we are proposing a portable...
Shin Watanabe
(ISAS/JAXA)
04/09/2013, 09:30
The Soft Gamma-ray Detector (SGD) is one of the ASTRO-H instruments and will feature wide energy band (60--600 keV) at a background level 10 times better than instruments currently in orbit. The SGD achieves low background by combining a Compton camera scheme with a narrow field-of-view active shield. The Compton camera in the SGD is realized as a hybrid semiconductor detector system which...
Angelo Rivetti
(Universita e INFN (IT))
04/09/2013, 10:20
Deep submicron CMOS technologies of the 130 nm generation are now the baseline choice to implement front-end electronics for tracking detectors, while the R&D in the 65 nm node is starting. In such technologies, new analogue to digital converters achieving 8-10 bit resolution, 50-100 MHz sampling frequency and 1mW of power have been demonstrated both by the industry and in the academia. This...
Marco Rossini
(Eidgenoessische Tech. Hochschule Zuerich (CH))
04/09/2013, 10:50
For the phase 1 upgrade of the CMS experiment the front end electronics of the pixel detector will be replaced to improve the readout efficiency at high luminosity. The redesign of the readout chip that is bump-bonded to the silicon sensor is an essential part of this upgrade. The first prototype versions of the new readout chip have been designed and produced. The results of the complete...
Geoff Hall
(Imperial College Sci., Tech. & Med. (GB))
04/09/2013, 11:10
The CBC2 is the latest version of the CMS Binary Chip ASIC for the readout of the upgraded CMS Tracker at the High Luminosity LHC. It is designed in 130nm CMOS with 254 input channels and will be bump-bonded to a substrate to which sensors will be wire bonded. The CBC2 is designed to instrument double layer modules, consisting of two overlaid silicon microstrip sensors with aligned...
Stephen Mcmahon
(STFC - Rutherford Appleton Lab. (GB))
05/09/2013, 08:40
We report on the operation and performance of the ATLAS Semi-Conductor Tracker (SCT), which has been functioning for 3 years in the high luminosity, high radiation environment of the Large Hadron Collider at CERN. The SCT is constructed of 4088 silicon detector modules, for a total of 6.3 million strips. Each module operates as a stand-alone unit, mechanically, electrically, optically and...
6.
Status of the ATLAS Pixel Detector at the LHC and its performance after three years of operation.
Timon Heim
(Bergische Universitaet Wuppertal (DE))
05/09/2013, 09:00
The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk,...
Alessandro Gabrielli
(Universita e INFN (IT))
05/09/2013, 09:40
During the first shutdown of the LHC collider in 2013/14, the Atlas experiment will be equipped with an innermost silicon layer, called IBL. Read-out electronics have been redesigned in order to accomplish the IBL performances. A new front end ASIC (FE-I4) has been designed as well as new off-detector devices. The latter are two 9U-VME cards called Back-Of-Crate and Read-Out Driver (ROD). The...
Jessica Lynn Leonard
(Deutsches Elektronen-Synchrotron (DE))
05/09/2013, 10:00
The CMS beam and radiation monitoring subsystem BCM1F (Fast Beam Conditions Monitor) consists of 8 individual diamond sensors situated around the beam pipe within the pixel detector volume, for the purpose of fast bunch-by-bunch monitoring of beam background and collision products. In addition, effort is ongoing to use BCM1F as an online luminosity monitor. BCM1F will be running whenever there...
Ilhan Tapan
(Uludag University)
05/09/2013, 11:00
The proposed Turkish Accelerator Center (TAC) Particle Factory is a super charm factory based on colliding a 1-GeV electron beam against a 3.5 GeV positron beam. The Particle Factory (TAC-PF) detector will be constructed for the detection of the producing particles from this collision. The main components of the preliminary design of TAC-PF detector are: tracker (SiT), time of flight (ToF),...
Takayuki Tsujikawa
(Waseda University)
05/09/2013, 11:40
We have tested the performance of two types of the latest Multi-Pixel Photon Counters (MPPCs; measuring 3 x 3 mm^2 in size) developed by Hamamatsu Photonics K.K. The new S12572-050C is a successor to the S10362-33-050C (i.e., conventional 3 x 3-mm^2 pixel MPPC of 50-μm pitch), comprises 3,600 Geiger mode avalanche photodiodes (APDs), and also features high gain (~ 1.25 x 10^6), a low dark...
Takuya FUJITA
(Waseda University)
05/09/2013, 14:00
We are developing a technique to fabricate fine spatial resolution (FWHM < 0.5mm) and cost-effective photon counting detectors, by using silicon photomultipliers (SiPMs) coupled with finely pixelated scintillator plate. Unlike traditional X-ray imagers that use a micro-columnar CsI(Tl) plate, we can pixelate various scintillation crystal plates more than 1mm thick, and easily develop...
Kawabata Nobukawa Kumiko
(Kyoto University)
05/09/2013, 14:20
We are developing the Soft X-ray Imager (SXI) on-board the ASTRO-H satellite, which is planned to be launched in 2015. The SXI consists of four CCDs arranged in a 2 by 2 mosaic and covers a wide field-of-view 38' by 38'. Since the CCDs are P-channel back-illuminated type and have the depletion layers of ~200 micrometers, the SXI has high quantum efficiency for X-rays in the wide range of...
Yohta KUREI
(Waseda University)
05/09/2013, 14:40
We have developed a high-resolution, compact Positron Emission Tomography (PET) module for future use in MRI-PET scanners. The module consists of large-area, 4 x 4 ch MPPC arrays (Hamamatsu S11827-3344MG) optically coupled with Ce:LYSO scintillators fabricated into 12 x 12 matrices of 1 x 1 mm^2 pixels. At this stage, a pair of module and coincidence circuits was assembled into an experimental...
Xinchou Lou
(University of Texas at Dallas (US))
05/09/2013, 15:00
Announcement of the next symposium, date, site, and briefing the site.
