Speaker
Description
The ATLAS IBL project led to an impressive progress in 3D radiation sensors, with experimental confirmation of their remarkable radiation tolerance with relatively low power dissipation, and the demonstration of medium volume productions with an acceptable yield. These accomplishments paved the way for using 3D sensors in other pixel detector systems in Phase 1 upgrades at the LHC (e.g., AFP and CT-PPS), and made them a very appealing option also for the innermost tracking layers at the HL-LHC. The latter application involves very high hit-rate capabilities, increased pixel granularity, extreme radiation hardness, and reduced material budget. Compared to existing 3D sensors, the future ones will have to be geometrically “downscaled”, involving smaller pitch (e.g., 50×50 or 25×100 μm2), shorter inter-electrode spacing (~30 μm), narrower electrodes (~5 μm), and reduced active thickness (~100 μm). The development of a new generation of 3D pixel sensors with these challenging features is under way by different groups in Europe, in collaboration with processing facilities like FBK, CNM, and SINTEF.
This talk will first review the lessons learned from existing 3D detectors. Then it will address the main design and technological issues for small pitch 3D devices. Preliminary results from the electrical and functional characterization of the first prototypes will be reported and compared to TCAD simulations.
