Speaker
Vyshnavi SUNTHARALINGAM
Description
Traditional integrated circuits consist of a single layer of
transistors interconnected with multiple layers of metal
wiring.
Three-dimensional integrated circuits (3D-ICs) consist of
two or more active circuit layers that are vertically
stacked and interconnected at high density. In addition
to reducing the wire length, 3-D interconnection of
active devices offers the potential for radically new
computer architectures, extremely dense memories,
and advanced focal planes that utilize the inherent
parallelism inherent in the 3D technology. In this talk
we will present work at MIT Lincoln Laboratory
over the last several years which targets new classes
of focal planes which exploit the parallelism of dense
vertical interconnection reaching to small pixel sizes.
