Sep 25 – 29, 2006
Valencia, Spain
Europe/Zurich timezone

3D electronics

Sep 25, 2006, 5:15 PM
Valencia, Spain

Valencia, Spain

IFIC – Instituto de Fisica Corpuscular Edificio Institutos de Investgación Apartado de Correos 22085 E-46071 València SPAIN




Traditional integrated circuits consist of a single layer of transistors interconnected with multiple layers of metal wiring. Three-dimensional integrated circuits (3D-ICs) consist of two or more active circuit layers that are vertically stacked and interconnected at high density. In addition to reducing the wire length, 3-D interconnection of active devices offers the potential for radically new computer architectures, extremely dense memories, and advanced focal planes that utilize the inherent parallelism inherent in the 3D technology. In this talk we will present work at MIT Lincoln Laboratory over the last several years which targets new classes of focal planes which exploit the parallelism of dense vertical interconnection reaching to small pixel sizes.

Primary author

Presentation materials