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Juan Antonio Fuster Verdú25/09/2006, 14:00Oral
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Antonio FERRER25/09/2006, 14:30Oral
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Mike LAMONT25/09/2006, 15:15OralThe status of the ongoing LHC installation is described with attention given to the long straight sections around the experiments. An overview of the proposed commissioning schedule for 2007 and 2008 presented. This schedule includes a calibration run at the end of 2007 which aims to deliver collisions at 450 GeV beam energy. The details of this run and planned beam conditions are...Go to contribution page
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Ernesto PEREA25/09/2006, 16:30OralThe seminar addresses recent advances in CMOS technologies. Technological limits, device-related limits and fundamental physical limits linked to the diminished feature sizes and their impact on analog performance and digital integration potential are discussed. Progress is made in new semiconductor/dielectric materials and in band-gap engineering to overcome some of the...Go to contribution page
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Vyshnavi SUNTHARALINGAM25/09/2006, 17:15OralTraditional integrated circuits consist of a single layer of transistors interconnected with multiple layers of metal wiring. Three-dimensional integrated circuits (3D-ICs) consist of two or more active circuit layers that are vertically stacked and interconnected at high density. In addition to reducing the wire length, 3-D interconnection of active devices offers the potential...Go to contribution page
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