Speaker
Description
During the $2023-2024$ shutdown, the Large Hadron Collider (LHC) will be upgraded to reach an instantaneous luminosity up to 7×10 $cm^{-2} s^{-1}$. This upgrade of the accelerator is called High-Luminosity LHC (HL-LHC). ATLAS and CMS tracking detectors will be replaced to meet the challenges of HL-LHC: an average of 200 pile-up events in every bunch crossing and an integrated luminosity of 3000 $fb^{-1}$ over ten years. Italian groups are involved in the R&D on the design and production of 3D sensors with thickness in the range 100 to 200 $\mu m$, 5 $\mu m$ diameter columns and smaller size pixel cells. The first pixel sensors produced by FBK in Trento have been bump-bonded by Leonardo to FE-I4 chips, the read-out electronics used in the new Pixel layer installed in ATLAS in 2014 (IBL).
This contribution is meant to be a poster reporting the laboratory measurements of 3D devices. The main purpose is to compare charge collection performance with two different radioactive sources ($^{241}Am$ and $^{90}Sr$) between IBL modules and the new FBK sensors, with the same pixel size of 50x250 $\mu m^{2}$ but different thickness. Furthermore an analysis of source scans for the FBK modules with different pixel cells, either 50x250 $\mu m^{2}$ or 50x50 $\mu m^{2}$, but same thickness, is performed. Both analysis compare for the same tuning threshold the results of ToT and clustering process.
