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AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

8–9 Apr 2013
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Contribution List

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  1. 27. Welcome Note
    Speranza Falciano (Universita e INFN, Roma I (IT))
    08/04/2013, 12:50
  2. 28. Event Overview
    Jean-Marie Le Goff (CERN)
    08/04/2013, 12:55
  3. 33. Particle Physics
    Dr Ronald Lipton (Fermi National Accelerator Lab. (US))
    08/04/2013, 13:00
  4. 34. Astroparticle Physics
    Giovanni Ambrosi (Universita e INFN (IT))
    08/04/2013, 13:40
  5. 36. 3D needs and opportunities in X-ray detection
    Heinz Graafsma (DESY)
    08/04/2013, 14:00
  6. 35. Medical Imaging
    Maria Giuseppina Bisogni (University Pisa, INFN pisa)
    08/04/2013, 14:20
  7. 37. Overview, state-of-the-art
    David HENRY (CEA-LETI-MINATEC)
    08/04/2013, 15:10
  8. 38. Keynote - Trend in Industry
    Mike Shapiro (IBM)
    08/04/2013, 15:40
  9. 42. CAD tools for 3D-IC and TSV-based designs
    Kholdoun TORKI (CMP)
    08/04/2013, 16:40
  10. 53. Methods for architectural design - methods of 3D-integrated systems
    Andy Heinig (EAS Fraunhofer Dresden)
    08/04/2013, 17:00
  11. 41. Method for selecting optimal 3D IC technology for detectors
    Makoto Motoyoshi (Tohoku-MincroTec Co., Ltd (T-Micro))
    08/04/2013, 17:20
  12. 44. Micro bump-bonding and TSV 3D integration expertise at Fraunhofer IZM
    Thomas Fritzsch (Fraunhofer IZM)
    08/04/2013, 17:40
  13. 46. Tezzaron TSV-related activities
    Robert Patti (Tezzaron Semiconductor)
    08/04/2013, 18:00
  14. 48. Packaging technologies at IMB-CNM (CSIC)
    Enric Cabruja Casas (IMB-CNM (CSIC))
    08/04/2013, 18:20
  15. 40. 3D Integration Technology used for Hybrid Pixel Detectors : Medipix project latest results
    David HENRY (CEA-LETI-MINATEC)
    08/04/2013, 18:40
  16. 47. SiPM Interconnections to 3D electronics
    Jelena Ninkovic (Max PlanckInstitute for Physics)
    09/04/2013, 09:15
  17. 49. Perspective of the sensor interconnectivity to the TSV readout ASIC
    Juha Kalliopuska (University of Helsinki Faculty of Science)
    09/04/2013, 09:30
  18. 50. development of HV CMOS - sensors for 3D integration
    Dr Ivan Peric (Ruprecht-Karls-Universitaet Heidelberg (DE))
    09/04/2013, 09:45
  19. 51. Vertical Integration techniques used for MEMS
    Mr Lutz Hofmann (Fraunhofer ENAS)
    09/04/2013, 10:00
  20. 52. IMEC's activities in imagers and imager stacking
    Piet De Moor (IMEC)
    09/04/2013, 10:15
  21. 54. Digital Photon Counting Technology – horizontal integration of SPAD and CMOS electronics
    Haemisch York (Philips Technologie GmbH)
    09/04/2013, 10:30
  22. 55. Capacitively coupled active sensors in 180nm HV-CMOS technology
    Daniel Muenstermann (CERN)
    09/04/2013, 10:45
  23. 57. Results of FE_TC4_P1, the first hybrid pixel circuit en Tezzaron-Chartered technology
    JCC Clemens (Centre National de la Recherche Scientifique (FR))
    09/04/2013, 11:00
  24. 58. IPDiA's Interposer and TSV solutions
    Stephane Bellenger (Belletech)
    09/04/2013, 11:15
  25. 43. The combined technology of TSV and SLID bond
    Armin Klumpp (Fraunhofer EMFT)
    09/04/2013, 12:00
  26. 45. TSV and SLID for planar Silicon Detectors
    Anna Macchiolo (Max-Planck-Institut fuer Physik (Werner-Heisenberg-Institut) (D)
    09/04/2013, 12:20
  27. 39. Shrinking 3D ICs - Capabilities and Frontiers of Through Silicon Via Technologies
    Armin Klumpp (Fraunhofer EMFT)
    09/04/2013, 12:40
  28. 56. Unconventional fabrication approaches create opportunities for 3D integration
    Andreas Fischer (KTH)
    09/04/2013, 13:00
  29. 31. Call for speakers
    for Applied R&D from Institutions and Industry to present capability
    Go to contribution page
  30. 32. Needs and challenges for ICT (CPU, CPU+Memory, Optolink, Imaging)
  31. 30. Solid-Liquid Interdiffusion
  32. 29. Through-Silicon-Vias (VIC and Interposers)