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AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

8–9 Apr 2013
LNF
Europe/Zurich timezone

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Contribution List

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27. Welcome Note
Speranza Falciano (Universita e INFN, Roma I (IT))
08/04/2013, 12:50
28. Event Overview
Jean-Marie Le Goff (CERN)
08/04/2013, 12:55
33. Particle Physics
Dr Ronald Lipton (Fermi National Accelerator Lab. (US))
08/04/2013, 13:00
34. Astroparticle Physics
Giovanni Ambrosi (Universita e INFN (IT))
08/04/2013, 13:40
36. 3D needs and opportunities in X-ray detection
Heinz Graafsma (DESY)
08/04/2013, 14:00
35. Medical Imaging
Maria Giuseppina Bisogni (University Pisa, INFN pisa)
08/04/2013, 14:20
37. Overview, state-of-the-art
David HENRY (CEA-LETI-MINATEC)
08/04/2013, 15:10
38. Keynote - Trend in Industry
Mike Shapiro (IBM)
08/04/2013, 15:40
42. CAD tools for 3D-IC and TSV-based designs
Kholdoun TORKI (CMP)
08/04/2013, 16:40
53. Methods for architectural design - methods of 3D-integrated systems
Andy Heinig (EAS Fraunhofer Dresden)
08/04/2013, 17:00
41. Method for selecting optimal 3D IC technology for detectors
Makoto Motoyoshi (Tohoku-MincroTec Co., Ltd (T-Micro))
08/04/2013, 17:20
44. Micro bump-bonding and TSV 3D integration expertise at Fraunhofer IZM
Thomas Fritzsch (Fraunhofer IZM)
08/04/2013, 17:40
46. Tezzaron TSV-related activities
Robert Patti (Tezzaron Semiconductor)
08/04/2013, 18:00
48. Packaging technologies at IMB-CNM (CSIC)
Enric Cabruja Casas (IMB-CNM (CSIC))
08/04/2013, 18:20
40. 3D Integration Technology used for Hybrid Pixel Detectors : Medipix project latest results
David HENRY (CEA-LETI-MINATEC)
08/04/2013, 18:40
47. SiPM Interconnections to 3D electronics
Jelena Ninkovic (Max PlanckInstitute for Physics)
09/04/2013, 09:15
49. Perspective of the sensor interconnectivity to the TSV readout ASIC
Juha Kalliopuska (University of Helsinki Faculty of Science)
09/04/2013, 09:30
50. development of HV CMOS - sensors for 3D integration
Dr Ivan Peric (Ruprecht-Karls-Universitaet Heidelberg (DE))
09/04/2013, 09:45
51. Vertical Integration techniques used for MEMS
Mr Lutz Hofmann (Fraunhofer ENAS)
09/04/2013, 10:00
52. IMEC's activities in imagers and imager stacking
Piet De Moor (IMEC)
09/04/2013, 10:15
54. Digital Photon Counting Technology – horizontal integration of SPAD and CMOS electronics
Haemisch York (Philips Technologie GmbH)
09/04/2013, 10:30
55. Capacitively coupled active sensors in 180nm HV-CMOS technology
Daniel Muenstermann (CERN)
09/04/2013, 10:45
57. Results of FE_TC4_P1, the first hybrid pixel circuit en Tezzaron-Chartered technology
JCC Clemens (Centre National de la Recherche Scientifique (FR))
09/04/2013, 11:00
58. IPDiA's Interposer and TSV solutions
Stephane Bellenger (Belletech)
09/04/2013, 11:15
43. The combined technology of TSV and SLID bond
Armin Klumpp (Fraunhofer EMFT)
09/04/2013, 12:00
45. TSV and SLID for planar Silicon Detectors
Anna Macchiolo (Max-Planck-Institut fuer Physik (Werner-Heisenberg-Institut) (D)
09/04/2013, 12:20
39. Shrinking 3D ICs - Capabilities and Frontiers of Through Silicon Via Technologies
Armin Klumpp (Fraunhofer EMFT)
09/04/2013, 12:40
56. Unconventional fabrication approaches create opportunities for 3D integration
Andreas Fischer (KTH)
09/04/2013, 13:00
31. Call for speakers
for Applied R&D from Institutions and Industry to present capability
32. Needs and challenges for ICT (CPU, CPU+Memory, Optolink, Imaging)
30. Solid-Liquid Interdiffusion
29. Through-Silicon-Vias (VIC and Interposers)
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