AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

Contribution List

27. Welcome Note

Speranza Falciano (Universita e INFN, Roma I (IT))

08/04/2013, 12:50

Welcome address

28. Event Overview

Jean-Marie Le Goff (CERN)

08/04/2013, 12:55

Welcome address

33. Particle Physics

Dr Ronald Lipton (Fermi National Accelerator Lab. (US))

08/04/2013, 13:00

Needs of communities

34. Astroparticle Physics

Giovanni Ambrosi (Universita e INFN (IT))

08/04/2013, 13:40

Needs of communities

36. 3D needs and opportunities in X-ray detection

Heinz Graafsma (DESY)

08/04/2013, 14:00

Needs of communities

35. Medical Imaging

Maria Giuseppina Bisogni (University Pisa, INFN pisa)

08/04/2013, 14:20

Needs of communities

37. Overview, state-of-the-art

David HENRY (CEA-LETI-MINATEC)

08/04/2013, 15:10

TSV-based Vertical Interconnections

38. Keynote - Trend in Industry

Mike Shapiro (IBM)

08/04/2013, 15:40

TSV-based Vertical Interconnections

42. CAD tools for 3D-IC and TSV-based designs

Kholdoun TORKI (CMP)

08/04/2013, 16:40

Through-Silicon Vias (TSV)

53. Methods for architectural design - methods of 3D-integrated systems

Andy Heinig (EAS Fraunhofer Dresden)

08/04/2013, 17:00

Through-Silicon Vias (TSV)

41. Method for selecting optimal 3D IC technology for detectors

Makoto Motoyoshi (Tohoku-MincroTec Co., Ltd (T-Micro))

08/04/2013, 17:20

Through-Silicon Vias (TSV)

44. Micro bump-bonding and TSV 3D integration expertise at Fraunhofer IZM

Thomas Fritzsch (Fraunhofer IZM)

08/04/2013, 17:40

Through-Silicon Vias (TSV)

46. Tezzaron TSV-related activities

Robert Patti (Tezzaron Semiconductor)

08/04/2013, 18:00

Through-Silicon Vias (TSV)

48. Packaging technologies at IMB-CNM (CSIC)

Enric Cabruja Casas (IMB-CNM (CSIC))

08/04/2013, 18:20

Through-Silicon Vias (TSV)

40. 3D Integration Technology used for Hybrid Pixel Detectors : Medipix project latest results

David HENRY (CEA-LETI-MINATEC)

08/04/2013, 18:40

Through-Silicon Vias (TSV)

47. SiPM Interconnections to 3D electronics

Jelena Ninkovic (Max PlanckInstitute for Physics)

09/04/2013, 09:15

Integration of sensors with 3D electronics

49. Perspective of the sensor interconnectivity to the TSV readout ASIC

Juha Kalliopuska (University of Helsinki Faculty of Science)

09/04/2013, 09:30

Integration of sensors with 3D electronics

50. development of HV CMOS - sensors for 3D integration

Dr Ivan Peric (Ruprecht-Karls-Universitaet Heidelberg (DE))

09/04/2013, 09:45

Integration of sensors with 3D electronics

51. Vertical Integration techniques used for MEMS

Mr Lutz Hofmann (Fraunhofer ENAS)

09/04/2013, 10:00

Integration of sensors with 3D electronics

52. IMEC's activities in imagers and imager stacking

Piet De Moor (IMEC)

09/04/2013, 10:15

Integration of sensors with 3D electronics

54. Digital Photon Counting Technology – horizontal integration of SPAD and CMOS electronics

Haemisch York (Philips Technologie GmbH)

09/04/2013, 10:30

Integration of sensors with 3D electronics

55. Capacitively coupled active sensors in 180nm HV-CMOS technology

Daniel Muenstermann (CERN)

09/04/2013, 10:45

Integration of sensors with 3D electronics

57. Results of FE_TC4_P1, the first hybrid pixel circuit en Tezzaron-Chartered technology

JCC Clemens (Centre National de la Recherche Scientifique (FR))

09/04/2013, 11:00

Integration of sensors with 3D electronics

58. IPDiA's Interposer and TSV solutions

Stephane Bellenger (Belletech)

09/04/2013, 11:15

Integration of sensors with 3D electronics

43. The combined technology of TSV and SLID bond

Armin Klumpp (Fraunhofer EMFT)

09/04/2013, 12:00

Chip stacking through microbump bonding

45. TSV and SLID for planar Silicon Detectors

Anna Macchiolo (Max-Planck-Institut fuer Physik (Werner-Heisenberg-Institut) (D)

09/04/2013, 12:20

Chip stacking through microbump bonding

39. Shrinking 3D ICs - Capabilities and Frontiers of Through Silicon Via Technologies

Armin Klumpp (Fraunhofer EMFT)

09/04/2013, 12:40

Frontiers in Interconnections

56. Unconventional fabrication approaches create opportunities for 3D integration

Andreas Fischer (KTH)

09/04/2013, 13:00

Frontiers in Interconnections

31. Call for speakers

for Applied R&D from Institutions and Industry to present capability

32. Needs and challenges for ICT (CPU, CPU+Memory, Optolink, Imaging)

30. Solid-Liquid Interdiffusion

29. Through-Silicon-Vias (VIC and Interposers)