09:00
|
New characterization techniques and facilities of common interest
(until 10:00)
|
09:00
|
WG5: Introduction
- Dr
Ivan Vila Alvarez
(Instituto de Física de Cantabria (CSIC-UC))
|
09:10
|
WG5: Task1 Example - TPA-TCT
-
Marcos Fernandez Garcia
(Universidad de Cantabria and CSIC (ES))
|
09:20
|
WG5: Task 2 Example - CARIBOU DAQ System
-
Dominik Dannheim
(CERN)
|
09:30
|
WG5: Task 3 - Example - Ion Beam testing and irradiations at RBI
-
Milko Jaksic
Milko Jakšić
|
09:40
|
Discussion
|
10:00
|
Non-silicon semiconductor and other material studies
(until 11:30)
|
10:00
|
WG6: Non-silicon semiconductor and other material studies, introduction
- Dr
Giulio Pellegrini
(Centro Nacional de Microelectrónica (IMB-CNM-CSIC) (ES))
|
10:05
|
WG6: Strategic R&D and opportunities - future activities
-
Thomas Bergauer
(Austrian Academy of Sciences (AT))
|
10:20
|
WG6: Plan for deliverables/milestones
-
Xin Shi
(Chinese Academy of Sciences (CN))
|
10:30
|
--- Coffee Break ---
|
11:00
|
WG6: Non-silicon semiconductor and other material studies (Discussion)
-
Alexander Oh
(University of Manchester (GB))
Thomas Koffas
(Carleton University (CA))
Xin Shi
(Chinese Academy of Sciences (CN))
Thomas Bergauer
(Austrian Academy of Sciences (AT)) Dr
Giulio Pellegrini
(Centro Nacional de Microelectrónica (IMB-CNM-CSIC) (ES))
|
11:30
|
Interconnect and device fabrication technologies
(until 13:20)
|
11:30
|
WG7: Introduction and analysis
-
Giovanni Calderini
(LPNHE-Paris, Centre National de la Recherche Scientifique (FR))
|
11:40
|
WP7: In-house interconnection technologies
-
Dominik Dannheim
(CERN)
|
11:50
|
WP7: Interconnection technologies via specialised vendors
-
Fabian Huegging
Fabian Huegging
(University of Bonn (DE))
|
12:00
|
WP7: Discussion
-
All
|